HECHT + DIEPER realized a tight encapsulation of an antenna inductor in a plastic backing plate by using the hot melt adhesive Macromelt. Hot melt molding based on polyamide offers a cheap alternative to traditional polyurethane or epoxy potting compounds in this example.
Unlike the classic plastic injection molding, processing of this hot melt happens at a significantly lower injection pressure. The low injection pressure does have the advantage that electronic components can be directly over-molded without damaging them.
